March 29, 2011

2007 JSME Award

We have selected as a JSME (Japan Society of Mechanical Engineer) Award Winner --JSME Medal for New Technology-- for our technical effort and the impact we have made to manufacturing world:

SC06 Gordon Bell Prize Finalist

A drop impact analysis of a mobile phone by ADVENTURECluster was selected as the Gordon Bell Prize Finalist in the conference SC06 (November 13-17, 2006, Tampa, Florida). The implicit structural drop impact analysis of the full assembled model of the mobile phone with 101 million nodal points and 305 million DOFs on IBM Blue Gene/L with 8 racks, 8192 nodes, 16384 processor core and 8192 processes has been been drawing a great attention.

Parallel Structural Analysis System ADVENTURECluster

ADVENTURECluster is the commercial distributed memory parallel CAE system based on ADVENTURE system, under collaboration with a number of universities, research institutes and companies.

ADVENTURECluster has been developed under the following concept:

• Runs on distributed memory parallel system.
• Unconstraint availability of taking the number of processors.
• Covers from pre-processing to post-processing.
• analyzes complex models without any simplification.
• The pre-processor generates meshes which reflects the model at great length, the solver analyses these large-scale meshes.
• The post-processor can visualize large-scale analysis results at a very high speed.
• Under the above methodology, ADVENTURECluster removes user's engineering judgment at great length.

	Platform MPI supported by Platform Computing is the standard parallel environment for ADVENTURECluster. Compared to MPICH, Platform MPI is advantageous in a way that better performance of communication on SMP or muti-core machines is obtained, or the same executable can be used to machines with various interconnects, etc. Refer to the Platform MPI site at Platform Computing.

		ADVENTURECluster Solver is supported to Microsoft Windows Compute Cluster Server 2003 (CCS)

	MEML Library for Pb-Free Solder
	MEML (Model of EcoMaterials Library) for Pb-free solder has been developed in cooperation with Toshiba Corporation and Ohno Laboratory at Nagoya University. The function can be used for evaluating reliability of electronics products that include Pb-free solder. Pb-free solder corresponds to RoHS (Restriction on Hazardous Substances) directive by EU (European Union).

Contact analysis of ADVENTURECluster is added on October 5, 2009

Xeon 5520 (Nehalem) Benchmark is added on August 17, 2009